| Size | RTP/PCAP | 3AS Model No | Viewing Area | TYPE | IC | Interface |
|---|
| 5" | PCAP | B050PFU-E01 | 109*65.8 | COF | EXC3111 | USB & I2C |
| 7" | PCAP | B070PFU-E04 | 155.24*87.12 | COF | EXC3111 | USB & I2C |
| 7" | PCAP | B070PFU-E05 | 154.6*91 | COF | EXC3111 | USB & I2C |
| 10.1" | PCAP | B101PFU-E03 | 217.56*136.2 | COF | EXC80W46 | USB & I2C |
| 11.6" | PCAP | B116PFU-E03 | 257.32*145.18 | COF | EXC80W46 | USB & I2C |
| 12.5" | PCAP | B125PFU-E02 | 277.48*156.52 | COF | EXC80W46 | USB & I2C |
| 13.3" | PCAP | B133PFU-E02 | 295.76*166.24 | COF | EXC80W46 | USB & I2C |
| 14" | PCAP | B140PFU-E02 | 310.31*174.99 | COF | EXC80W46 | USB & I2C |
| 15" | PCAP | B150PFU-E01
(GFF) | 305.33*229.3 | COF | EXC80W60 | USB & I2C |
| 15.6" | PCAP | B156PFU-E03 | 345.24*194.68 | COF | EXC80W60 | USB & I2C |
| 17.3" | PCAP | B173PFU-E02 | 382.89*215.8 | COF | EXC80W60 | USB & I2C |
| 18.5" | PCAP | B185PBU-E01 | 410.8*231.4 | COB | EXC80W83 | USB |
| 21.5" | PCAP | B215PBU-E05 | 477.7*269.4 | COB | EXC80W84 | USB & I2C |
| 23.8" | PCAP | B238PBU-E01 | 528.6*298 | COB | EXC80W84 | USB & I2C |
| 27" | PCAP | B270PBU-E03 | 599*337.7 | COB | EXC80W84 | USB & I2C |
| 32" | PCAP | B320PBU-E01 | 699.4*393.85 | COB | EXC80W83 | USB |
| 43" | PCAP | B430PBU-E02 | 943.2*531.4 | COB | EXC80H100 | USB & RS232 |
| 5.7" | RTP | B057R5U-E01 | 117.2 * 88.4 | COB | - | USB |
| 6.5" | RTP | B065R5U-E01 | 137.08 * 103.96 | COB | - | USB |
| 7" | RTP | B070R5U-E02 | 156.10 * 88.60 | COB | - | USB |
| 8.4" | RTP | B084R5U-E01 | 173.80 * 131.20 | COB | - | USB |
| 10.1" | RTP | B101R5U-E01 | 219.56 * 138.20 | COB | - | USB |
| 10.4" | RTP | B104R5U-E03 | 213.2 * 160.4 | COB | - | USB |
| 12.1" | RTP | B121R5U-E01 | 249.80 * 188.50 | COB | - | USB |
| 15" | RTP | B150R5U-E02 | 309.5 * 233.5 | COB | - | USB |
| 15.6 | RTP | B156R5U-E01 | 347.93 * 196.94 | COB | - | USB |
| 17" | RTP | B170R5U-E01 | 343.00 * 275.50 | COB | - | USB |
| 19" | RTP | B190R5U-E01 | 380.90 * 305.65 | COB | - | USB |
Class 1,000 clean room:Brightness Enhancement and Bonding solutions were being process.
